This FPD-Link™ III camera is ideal for vision system evaluation and demo platforms. It is designed for use with D3 Engineering’s DesignCore® RVP (Rugged Vision Platform) Development Kits. The D3CM features the Sony® IMX224 sensor and optics in an unsealed (non-rugged) enclosure. It has industrial environmental ratings.
151 deg FOV, 76 deg FOV
Evaluation or production systems.
Available starting at quantity of 25. Contact D3.
DesignCore RVP-TDA3x Development Kit with 4Ghz FPD-Link™ III SerDes